THE ENDEAVOR SYSTEM IS A DUAL-CATHODE S-GUN™ MAGNETRON PROVIDING STATE-OF-THE-ART PVD FILMS.

The Endeavor PVD system is used for sputtering thin, dense, highly uniform films for frontside and backside applications. Coatings are contamination-free and have low residual stress. The individually controlled dual target configuration is ideal for reactively sputtered films such as metal oxides and advanced piezoelectric materials.

产品详情

Procerss

Reactively sputtered films (with N2 or O2)

  • Stress control (RF bias and SAU)
  • Piezoelectric films (e.g., AlN, ScAlN)
  • Backside and frontside metallization
  • Dielectric films (e.g., FiltersBragg Reflectors) with tiled target capability for stoichiometry adjustment

技术规格

FEATURES

  • Inductive Couple Plasma (ICP)
  • Deep Silicon Etch™ (DSE)
  • Reactive Ion Etch (RIE)
  • Ion Bean Etch (IBE™)
  • Ion Beam Deposition (IBD™)
  • Plasma Enhanced Chemical Vapor Deposition (PECVD)
  • High-Density Plasma Chemical Vapor Deposition (HDPCVD)
  • Large-Area PECVD™ System
  • High-Density Radical Flux (HDRF™)