VERSALINE®
OUR VERSALINE PLATFORM IS THE WORKHORSE FOR A VARIETY OF APPLICATIONS IN SPECIALTY SEMICONDUCTOR MARKETS

 

VERSALINE system models are configured to perform an array of etch and deposition processes. Ion beam technology suits a range of applications, from low, controllable damage etching to high-rate, high-aspect-ratio, deep silicon etching to difficult materials. The systems support process control through EndpointWorks®. Enhancements include data logging, automated maintenance scheduler (AMS), and SECS/GEM. Our Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity.

产品详情

VERSALINE ETCH

The VERSALINE platform’s modular design allows for flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a loadlock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy.

技术规格

FEATURES

  • Inductive Couple Plasma (ICP)
  • Deep Silicon Etch™ (DSE)
  • Reactive Ion Etch (RIE)
  • Ion Bean Etch (IBE™)
  • Ion Beam Deposition (IBD™)
  • Plasma Enhanced Chemical Vapor Deposition (PECVD)
  • High-Density Plasma Chemical Vapor Deposition (HDPCVD)
  • Large-Area PECVD™ System
  • High-Density Radical Flux (HDRF™)